Formosa Bumping Solder Paste

Company Information:

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

TaoYuan County, Taiwan

Manufacturer

+886-3-416-0177
+886-3-416-0133

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Company Postings:

(18) products in the catalog

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Name:	Formosa Bumping Solder Paste
Category:	Solder Materials
Offered by:	Shenmao Technology Inc.

Formosa Bumping Solder Paste Description:

Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void, <100000ppm, of formula. It’s approved by our customers that can decrease void happened and optimizes the performance of manufacturing process. Our Bumping Solder Paste was well-developed to have 6 month shelf life and can be storage just less than 10 degree C.

Formosa Bumping Solder Paste was added in Feb 2017

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