LPKF Laser & Electronics

With its broad product range LPKF is one of the world market leaders in the "in-house rapid PCB prototyping" and "StencilLaser" services

Manufacturer

Established in 1976, LPKF Laser & Electronics manufactures machines and laser systems used in circuit board and microelectronics fabrication, medical technology, the automotive sector, and the production of solar cells.

LPKF’s worldwide headquarters is located in Garbsen, Germany outside of Hannover which maintains North American headquarters in Portland, OR.

LPKF's ProtoMat family of systems provides an ideal PCB prototyping machine for virtually any engineering environment. Every LPKF ProtoMat® PCB prototyping machine is built to be the best of its class, with thousands of installed quickturn systems to prove it. Each PCB milling machine system has its own special system features. Some prototype milling machines feature milling, drilling, routing and depanelization; some feature a new generation of advanced boards and circuit board plotters. Other prototype milling machines have automatic tool change and are ideal for exotic substrates and flex. The LPKF Laser & Electronics AG is developing quickturn systems and process solutions for demanding tasks in printed circuit board technology and microelectronics.

Contact us today for more information regarding our PCB quickturn machine equipment systems.

LPKF Laser & Electronics Postings

10 products »

ProtoPlace S - Semi-automatic SMT assembly system

SMT Pick & Place of PCB Prototypes The LPKF ProtoPlace S is an ergonomically designed, semi-automatic pick & place system for the professional assembly of SMT printed circuit board prototypes and small batch projects. The P...

Pick & Place

ProtoPlace S - Semi-automatic SMT assembly system

ProtoFlow S - Lead-Free Reflow Oven

Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even...

Reflow

ProtoFlow S - Lead-Free Reflow Oven

ProMask - Instant solder mask for prototype PCB’s

An easy-to-use cost-effective solution for producing professionally masked PCBs in an in-house prototyping environment. Compact, quick and easy to use Professional finish and perfect soldering...

Solder Materials

ProMask - Instant solder mask for prototype PCB’s

StencilLaser G 6080

The Most Efficient SMT Solder Paste Stencil Cutter Available The StencilLaser G 6080 Model 2011 represents everything LPKF is renowned for: Worldwide leadership in designing highly sophisticated products, inspired by customers. The...

Printing

StencilLaser G 6080

LPKF Flex Cutting and Depaneling Systems

When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product...

Depaneling

LPKF Flex Cutting and Depaneling Systems

LPKF MicroLine 1120 S - Laser Depaneling System

Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex conto...

Depaneling

LPKF MicroLine 1120 S - Laser Depaneling System

LPKF ProtoMat H100 PCB Milling

Fully Automated for High-Performance Rapid PCB Prototyping Applications: Milling/drilling 1- & 2-sided PCBs Milling/drilling RF- & microwave substrates Multilayer PCBs up to...

Prototyping

LPKF ProtoMat H100 PCB Milling

LPKF ProtoLaser - PCB Laser Etching Systems

The next generation of in-house prototyping Laser-based PCB production can achieve much greater circuit detail, and lasers structure circuits significantly faster. This technology provides true on-demand production solution for bot...

Prototyping

LPKF ProtoLaser - PCB Laser Etching Systems

LPKF ProConduct® - Through-hole Conductivity System

In-House PCB Through-Hole Plating without Chemicals The LPKF ProConduct® introduces revolutionary technology to produce plated through-holes, which does not require a plating tank or potentially hazardous processing chemicals. This...

Through-Hole

LPKF ProConduct® - Through-hole Conductivity System

LPKF ProtoMat® S-Series - PCB Milling Machines

The ProtoMat® S-Series provides precise, quick and simple in-house PCB prototyping, delivering PCBs in hours instead of days. The reduction of time and money spent on outsourcing services translates into greater project momentum, increased...

Prototyping

LPKF ProtoMat® S-Series - PCB Milling Machines

3 technical articles »

Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards

Sep 11, 2019 | Ahne Oosterhof, Eastwood Consulting, Javier Gonzalez, LPKF Laser & Electronics AG

There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling....

Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling

Apr 27, 2017 | Ahne Oosterhof, Eastwood Consulting

Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects.

This paper presents an in-depth analysis of the various laser system operating parameters that were performed to determine the resulting substrate material temperature changes. A theoretical model was developed and compared to actual measurements. The investigation includes how the temperature increase resulting from laser energy during depaneling affects the properties of the PCB substrate, which varies from no measurable change to a lowering of the surface resistance of the cut wall depending on the cutting parameters....

Bringing Rapid Prototyping In-House - A White Paper for RF/Microwave Executives

Feb 22, 2013 | LPKF

Productivity. Innovation. Time to market. Day to day, year over year, businesses are forced to make critical R.O.I.—related decisions that impact the future and the bottom line—some of them reactionary, some forecasted. For a growing number of electronics manufacturers, many of those decisions revolve around whether a function should be performed by an outside contractor or kept in-house. But for many companies in the RF/microwave industry, this decision is often concerned with continuing to employ an outside PCB fabricator for prototype PCBs, or to make a $10,000 to $100,000 investment in an inhouse, rapid PCB prototyping machine that may represent a key competitive advantage....

33 news releases »

LPKF Expands Management Team

Jan 29, 2014 | The fast-paced expansion of Garbsen-based laser specialist, LPKF Laser & Electronics AG, is continuing unabated. With over 750 employees around the world, LPKF has now expanded its management teams at its Fürth (Germany) and Naklo (Slovenia) production locations.

Rapid Prototyping of Printed Circuit Boards at AFCEA West

Jan 16, 2014 | LPKF Laser & Electronics will exhibit at AFCEA West 2014. LPKF provides in-house rapid PCB prototyping systems for a variety of applications and will demonstrate its best-selling prototyping system, the ProtoMat S63, in booth 1542.

New LPKF ProtoMat D104 with UV Laser Tool

Nov 21, 2013 | LPKF Laser & Electronics AG presents a spectacular new development: The LPKF ProtoMat D104 unites the best features of advanced LPKF ProtoMats with the high precision of the ProtoLaser systems. The highlight of this product innovation is a special UV laser.

Step-Up Stencils with the StencilLaser

Nov 21, 2013 | A step stencil is an SMD stencil made with local depressions (step-down) or raised areas (step-up) to allow the solder paste volume to be varied locally. This allows for mounting of both SMD components with a low pitch and robust connection components on PCBs in a single step.

LPKF raises guidance slightly for 2013

Nov 15, 2013 | LPKF remains on track for success, even though revenue growth has slowed somewhat in the year’s third quarter, as expected.

Wave of innovation at productronica fair - LPKF presents four new systems in Hall B2, Booth 105

Sep 10, 2013 | The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening, the specialist in micro-material processing presents four new systems and procedures

In-House PCB Prototyping Comes to Eptech Mississauga and Ottawa

Aug 27, 2013 | In-house PCB prototyping specialist LPKF Laser & Electronics has announced it will exhibit at both Eptech Mississauga and Eptech Ottawa. At both shows LPKF will provide educational information about its rapid PCB prototyping equipment, including mechanical milling and laser etching systems.

PCB Processing Solutions a Highlight of IPC/APEX Expo 2013

Jan 18, 2013 | LPKF Laser & Electronics will exhibit at the 2013 IPC/APEX Exposition. Situated in booth 2333, LPKF will showcase the MicroLine 1120 P, a compact UV laser system designed for processing bare PCBs.

New Webinar Explores SMT Stencil Aperture Size and its Relationship with Solder Paste Volume

Dec 03, 2012 | LPKF Laser & Electronics will present the webinar Stencil Aperture Size and Its Impact on the Printing Process Thursday, December 6, 2012 at 11 a.m. PST. The webinar examines the relationship between stencil aperture size and solder paste volume and how the stencil manufacturing process can influence both.

LPKF to Showcase UV Depaneling System at SMTA International

Sep 12, 2012 | LPKF Laser & Electronics will exhibit at the upcoming SMTA International Conference and Exposition

23 more news releases from LPKF Laser & Electronics »

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155 : 				</CFIF>
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SQLSTATE   08001
DATASOURCE   admanager_mysql
SQL    SELECT start_date, adid, end_date, camp_views, image_name, alt_text, views, targeted FROM adsystem WHERE section = 'company_1' AND active = 1 AND adsize = 'Text' AND start_date <= Now()
Resources:

Browser   claudebot
Remote Address   34.228.43.90
Referrer  
Date/Time   29-Mar-24 09:27 AM
Stack Trace
at cfadsystem_mod2ecfm1546098271._factor16(/var/www/smtnet/adsystem/adsystem_mod.cfm:154) at cfadsystem_mod2ecfm1546098271.runPage(/var/www/smtnet/adsystem/adsystem_mod.cfm:1) at cfdsp_global_layout2ecfm1131192918._factor1(/var/www/smtnet/dsp_global_layout.cfm:422) at cfdsp_global_layout2ecfm1131192918._factor27(/var/www/smtnet/dsp_global_layout.cfm:389) at cfdsp_global_layout2ecfm1131192918.runPage(/var/www/smtnet/dsp_global_layout.cfm:1) at cfdsp_layout2ecfm507669117.runPage(/var/www/smtnet/company/dsp_layout.cfm:1) at cfindex2ecfm100786478._factor4(/var/www/smtnet/company/index.cfm:260) at cfindex2ecfm100786478._factor36(/var/www/smtnet/company/index.cfm:120) at cfindex2ecfm100786478._factor37(/var/www/smtnet/company/index.cfm:11) at cfindex2ecfm100786478.runPage(/var/www/smtnet/company/index.cfm:1)

com.mysql.jdbc.exceptions.jdbc4.MySQLNonTransientConnectionException: Could not create connection to database server. Attempted reconnect 3 times. Giving up.
	at sun.reflect.GeneratedConstructorAccessor917.newInstance(Unknown Source)
	at sun.reflect.DelegatingConstructorAccessorImpl.newInstance(DelegatingConstructorAccessorImpl.java:45)
	at java.lang.reflect.Constructor.newInstance(Constructor.java:423)
	at com.mysql.jdbc.Util.handleNewInstance(Util.java:395)
	at com.mysql.jdbc.Util.getInstance(Util.java:370)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:999)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:973)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:959)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:904)
	at com.mysql.jdbc.ConnectionImpl.connectWithRetries(ConnectionImpl.java:2369)
	at com.mysql.jdbc.ConnectionImpl.createNewIO(ConnectionImpl.java:2290)
	at com.mysql.jdbc.ConnectionImpl.<init>(ConnectionImpl.java:818)
	at com.mysql.jdbc.JDBC4Connection.<init>(JDBC4Connection.java:31)
	at sun.reflect.GeneratedConstructorAccessor85.newInstance(Unknown Source)
	at sun.reflect.DelegatingConstructorAccessorImpl.newInstance(DelegatingConstructorAccessorImpl.java:45)
	at java.lang.reflect.Constructor.newInstance(Constructor.java:423)
	at com.mysql.jdbc.Util.handleNewInstance(Util.java:395)
	at com.mysql.jdbc.ConnectionImpl.getInstance(ConnectionImpl.java:400)
	at com.mysql.jdbc.NonRegisteringDriver.$fr$connect(NonRegisteringDriver.java:346)
	at com.mysql.jdbc.NonRegisteringDriver.connect(NonRegisteringDriver.java)
	at coldfusion.server.j2ee.sql.pool.JDBCPool.createPhysicalConnection(JDBCPool.java:614)
	at coldfusion.server.j2ee.sql.pool.ConnectionRunner$RunnableConnection.run(ConnectionRunner.java:67)
	at java.lang.Thread.run(Thread.java:748)
Caused by: com.mysql.jdbc.exceptions.jdbc4.MySQLNonTransientConnectionException: Data source rejected establishment of connection,  message from server: "Too many connections"
	at sun.reflect.GeneratedConstructorAccessor917.newInstance(Unknown Source)
	at sun.reflect.DelegatingConstructorAccessorImpl.newInstance(DelegatingConstructorAccessorImpl.java:45)
	at java.lang.reflect.Constructor.newInstance(Constructor.java:423)
	at com.mysql.jdbc.Util.handleNewInstance(Util.java:395)
	at com.mysql.jdbc.Util.getInstance(Util.java:370)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:999)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:973)
	at com.mysql.jdbc.SQLError.createSQLException(SQLError.java:959)
	at com.mysql.jdbc.MysqlIO.doHandshake(MysqlIO.java:1112)
	at com.mysql.jdbc.ConnectionImpl.coreConnect(ConnectionImpl.java:2467)
	at com.mysql.jdbc.ConnectionImpl.connectWithRetries(ConnectionImpl.java:2308)
	... 13 more