MULTICORE Solder Pastes
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MULTICORE Solder Pastes |
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MULTICORE Solder Pastes Description:
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as proven, traditional tin-lead formulations, MULTICORE brand solder materials are enabling the production of some of today’s most advanced products.
Our portfolio of solder paste materials addresses a variety of manufacturing requirements and offers performance characteristics unmatched by any other materials supplier. Low voiding lead-free solder pastes, halogen-free and halide-free pastes, no-clean pastes, water-wash pastes and crossover pastes for mixed-metal manufacturing are all part of our vast offering. Supporting ultra-fine pitch printing at high speed, delivering long open and abandon times and pin-testability across all types of assemblies and surface finishes,
MULTICORE pastes deliver the flexibility modern electronics firms require to stay competitive. Our materials also offer outstanding resistance to high temperature and high humidity, providing multinational firms with the confidence they need to deploy MULTICORE materials on a global level with consistent performance. Plus, all of our products are supported locally with outstanding technical expertise and are backed by Henkel’s global infrastructure and inimitable resource base.
Henkel Solder Paste Products: |
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Pb-Free - Halide-Free Solder Pastes |
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A halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes. |
97SC (SAC305) |
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A halide-free, no-clean, low-voiding, Pb-free solder paste with excellent humidity resistance and broad process window. Suitable for both reflow and printing. |
97SC (SAC305) |
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A halide-free, no-clean, low-voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow. Four hours between print abandon time even on small CSP apertures. |
96SC (SAC387) |
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Pb-Free - Halogen-Free Solder Pastes |
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A halogen-free, no-clean, low-voiding Pb-free solder paste development product. Shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including Immersion Ag and OSP copper. |
96SC (SAC387) |
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A halogen-free, no-clean, low-voiding Pb-free solder paste. Shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including OSP copper. |
97SC (SAC305) |
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Pb-Free - Water Wash Solder Pastes |
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A no-clean flux system specially formulated for lead-free alloys. High performance, water washable solder paste. Residues are easily removed with DI water, without the need for a saponifier. Good open time with excellent print definition and soldering. |
96SC (SAC387) |
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SnPb - No-Clean Solder Pastes |
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A modest residue level solder paste for printing and reflow in air. Non-corrosive residues which eliminates the need for cleaning. Excellent resistance to solder balling and suitable for fine pitch, stencil printing applications. |
Sn62, Sn63 |
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A no-clean solder paste for high speed printing and reflow in both air and nitrogen. Extended printed open time and tack life. Resistant to both hot and cold slump. |
Sn62, Sn63 |
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High activity, soft residue, colorless, halide-free, no-clean solder paste that displays outstanding resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, and large high-density circuit boards. |
Sn62/Sn63/63S4 (Anti-Tombstoning) |
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SnPb - Water Wash Solder Pastes |
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High performance, water-washable solder paste. Residues are readily removed with DI water, without the need for a saponifier. Good open time with excellent print definition and soldering activity. |
Sn62/Sn63 (Anti-Tombstoning) |
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MULTICORE Solder Pastes was added in Dec 2013
MULTICORE Solder Pastes has been viewed 1592 times
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