HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System Description:

• The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array.
• Alignment is achieved through precision pins and specific tooling for ease of use, repeatability, and accuracy in sphere placement.
• "Black Contrast" for easy visual inspection or arrays.
• Repeatable process control to insure co-planarity and uniformity. MODEL 9000-1
• Fits virtually all BGA layouts and sphere sizes.
• Self-contained system, no additional air/vacuum required.
• Ideal for Lower Volume Manufacturers, Rework, and Prototyping.

Process:

• Place component in alignment plate.
• Turn vacuum on.
• Remove residual solder and/or contaminates.
• Print flux on the component using appropriate stencil.
• Load wand with sphere's using vacuum pick-up.
• Align Wand using tooling pins.
• Depress foot pedal to release the full array of sphere's.
• Lift block.
• Remove component from carrier.
• Reflow the part using proper profile.

Additional KIT setups:

• Single or multiple component capabilities.
• Custom tooling available.
• Complete set-up achieved in seconds!
• Very minimal operator training necessary.
• Send your drawing or a sample to HEPCO's Engineers