SE500ULTRA™ High-Speed 3D SPI
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SE500ULTRA™ High-Speed 3D SPI |
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SE500ULTRA™ High-Speed 3D SPI Description:
World-Class Accuracy At Fastest Speed.
The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor.
An all-new, improved ultrafast sensor combined with a unique ‘all-in-one’ scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence – makes the SE500ULTRA 30% faster at 210cm²/sec.
The optional Dual Illumination sensor further enhances repeatability and reproducibility even on the smallest paste deposits. For improved repeatability, you can choose from the MicroPad and Dual Illumination sensor options for accurately measuring pads as small as 100 microns (4mils).
- All-new, Ultrafast sensor with calibration-free design
- 30% faster with unique ‘all-in-one’ scan sequence
- New, Intuitive Touch Screen Interface with World-class Usability
- Improved Repeatability with Dual Illumination Sensor Option
- Closed Loop Printer Feedback Ready
- CyberPrint OPTIMIZER™ Ready
- Mounter Feed Forward Ready
| Board Size (Max.) | 510 x 510 mm |
|---|---|
| Board Size (Min.) | 50 x 50 mm |
| Inspection Speed @ 30µm | Up to 210cm²/sec |
| Inspection Speed @ 15µm | 80cm²/sec |
| Gage R&R | <<10%, 6σ |
SE500ULTRA™ High-Speed 3D SPI was added in Jun 2015
SE500ULTRA™ High-Speed 3D SPI has been viewed 673 times
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