AW-B3000 Barrel Batch Plasma Asher Descum Equipment

AW-B3000 Barrel Batch Plasma Asher Descum Equipment Description:

sales@allwin21.com

The AW-B3000 batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership. .

Key Features:       

1.         Production-proven plasma Stripper/Asher/Descum technology.
2.         Up to 25% Uniformity. Much lower if used with a Faraday Cage.
3.         Consistent wafer-to-wafer uniformity.
4.         TC Option can be used with an N2 Plasma to heat the wafers up to 170°C (Chamber) to increase ash rate.
5.         End-of-Process (EOP) Option automatically stops the Process after all wafers are fully stripped regardless of wafer quantity or photoresist thickness.
6.         Samples, 6” square, and up to 8” round wafers capable.
7.         Many wafer sizes capability without hardware change.
8.         Can handle different thickness wafer with different carriers.
9.         New controller with PC with Advanced AW Software
10.         Up to 5 isolated gas lines with MFC’s
11.         13.56 MHz RF Generator.  (Air-cooled Optional)
12.         Pressure Control Throttle Valve for better process repeatability.  (Optional)
13.         MKS Baratron (Optional)
14.         Touch screen GUI
15.         EMO, Interlocks and Watchdog function
16.         GEM/SECS II (Optional)
17.         Made in U.S.A. 

Software Features:

1. Integrated process control system
2. Real time graphics display
3. Real time process data acquisition, display, and analysis
4. Programmed comprehensive calibration and diagnostic functions
5. Closed-loop temperature control with temperature sensing.
6. Precise time-temperature profiles tailored to suit specific process requirements.
7. Faster, easier Programmable comprehensive calibration of all subsystems, leading to enhanced process results.
8. A recipe editor to create and edit recipes to fully automate the processing of wafers inside the AccuThermo RTP
9. Validation of the recipe so improper control sequences will be revealed.
10. Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
11. Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions.
12. Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
13. Troubleshooting feature which allows engineers and service personnel to activate individual subassemblies and functions. More I/O, AD/DA “exposure”.
14. Use PowerSum technology to detect the process and increase Yield.
15. Watchdog function: If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
16. GEM/SECS II function (Optional).

Configuration:

1.           Main Body with wires
2.           Control Box
3.           Pentium Class PC with AW Software
4.           Keyboard, Mouse, USB with SW backup and Cables
5.           Main Control PCB and DC
6.           Transformer, Circuit Breaker,Contactor
7.           1-5 Isolated Gas Lines w/ Pneumatic Valve and MFC
8.           Purge has manual regulator in controller box to control speed.
9.           Quartz Chamber:Dia 12” x Depth 23”;
10.           RF Match Network Integrated in the Main Body of tool.
11.           Chamber Door with quartz plate in the Main Body.
12.           Gas and vacuum lines Connections in the Main Body
13.           13.56MHz RF Generator (Air-Cooled is Optional)  : ① 300W;  ② 600W;  ③ 1000W;  ④ 1200W
14.           Lamp tower alarm with buzzer
15.           Main Vacuum Valve
16.           MKS Baratron
17.           Throttle Valve
18.           Front EMO, Interlocks
19.           15-inch Touch Screen GUI

Options:

1. End-of-Process (EOP) function.
2. Throttle Valve for pressure control.
3. Air-cooled RF Generator.
4. GEM/SECS II function (Software)
5. Thermocouple for Chamber Temperature
6. Vacuum Pump

Specifications:

1. Wafer Size: Sample to 200mm Capability.  Multiple wafer size without hardware change
2. High Throughput: Up to 75 WPH. Process Dependent.
3. Temperature: Only TC Option can be used for N2 plasma to heat the substrates up to 170°C.
4. Gas Lines: Up to 5 isolated gas lines with MFCs.
5. Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR.  Slower if Faraday Cage is used
6. Uniformity: Up to 25%. Much lower with Faraday Cage.
7. Particulate: <0.05 /cm2 (0.03um or greater)
8. Damage: Low damage with Faraday Cage.
9. Selectivity: >1000:1
10. MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.
11. 95% uptime
12. * Contact Allwin21 sales for other applications and specifications.

sales@allwin21.com