SMT Equipment

ePaste Lead-Free Solder Paste

Company Information:

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Osaka, Japan

Manufacturer

  • Phone 81-(0)6-6380-1121
  • Fax 81-(0)6-6380-1262

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ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

Name:

ePaste Lead-Free Solder Paste

Category:

Solder Materials

Offered by:

Nihon Superior Co., Ltd.

ePaste Lead-Free Solder Paste Description:

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow and hand soldering as well as spheres for the attachment of area array packages.

The fluidity of SN100C is an advantage in hand soldering where, in combination with the right core flux (030), it is possible to complete more than 35 average joints per minute with a tip temperature of only 380°C.

The 227°C melting point of SN100C was first thought to preclude its use in reflow soldering. However, when it was noted that tin-silver-copper alloys (such as SAC305 with a melting point of 217°C to 218°C) are typically reflowed with a peak temperature around 245°C, it was realised that SN100C could be a replacement.

Nihon Superior now offers two types of SN100C solder paste. These are no-clean ePaste for general reflow purposes, and ePaste; a special low voiding paste for critical applications such as die attach in which heat transfer though the joint must be maximised. As an additional ePaste, SN100C is now available as a high-performance solder paste with a general purpose P500 flux medium.

ePaste Selection:

General Purpose SN100C P500 D4(Sn-Cu-Ni+Ge)

SN100C P500 D4

SN100C P500 D4 is a general purpose solder paste suitable for fine pitch applications. In most cases SN100C can be reflowed with a profile similar to that used with SAC alloys.

Peak Reflow Temperature: 240oC±5oC

For 01005(0402 metric) Chip Components SN100C P520 D5 (Sn-Cu-Ni+Ge)

SN100C P520 D5

High reliability lead-free solder paste optimized to deliver good reflow with chip components down to 0402 metric. SN100C P520 D5 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine pitch mounting in which a reduction in joint strength is a concern due to the very small joint size.

Reflowed with peak 240℃±5℃

Halogen-Free SN100C P602 D4(Sn-Cu-Ni+Ge)

Halogen-Free SN100C P602 D4

High Activity Halogen-Free Solder Paste SN100C (Sn-0.7Cu-0.05Ni+Ge) lead-free solder paste which does not contain halogens (F, Cl, Br, and I). No whisker observed as a result of the test that 1000 hour exposure under 85C/85% conditions.

Peak Reflow Temperature: 240oC±5oC

Halogen-Free Dispensing Grade SN100C P603 D4(Sn-Cu-Ni+Ge)

Halogen-Free Dispensing Grade SN100C P603 D4

High reliability completely Halogen-Free Solder Paste based on Lead-Free solder alloy SN100C(Sn-0.7Cu-0.05Ni+Ge). Does not contain F, Cl, Br or I and offers superior dispensing stability that ensures no missed joints. General Purpose Paste for 0402 (1005 metric) Chip Components.

Peak Reflow Temperature: 240oC±5oC

Halogen-Free Dispensing Grade SN100C P605 D6(Sn-Cu-Ni+Ge)

Halogen-Free Dispensing Grade SN100C P605 D6

High reliability completely Halogen-Free Solder Paste based on Lead-Free solder alloy SN100C(Sn-0.7Cu-0.05Ni+Ge). Does not contain F, Cl, Br or I and offers superior dispensing stability that ensures no missed joints. For Chip Components down to 01005 (0402 metric)

Peak Reflow Temperature: 240oC±5oC

For Power Semiconductor SN100C P800 D2 (Sn-Cu-Ni+Ge)

SN100C (SnCuNi+Ge) P800 D2 is a high reliability paste for device assembly that reduces voiding and reflow time.

Peak Reflow Temperature: 260oC±10oC

For Reducing voiding SN100C P810 D4(Sn-Cu-Ni+Ge)

SN100C P810 D4 is low-voiding lead-free solder paste. When reflowed with SN100C P810 D4 large-area solder joints such as those between power semiconductors and their substrates have a lower incidence of voiding than if reflowed with conventional lead-free solder paste. While delivering low voiding this high reliability lead-free solder paste is also formulated to deliver excellent reflow with minimum mid-chip balling and exhibits excellent wetting on all common substrates.

Peak Reflow Temperture: 240℃±5℃

SN96CI PF-33 FMQ(Sn-Ag-Cu)

SN96CI PF-33 FMQ

Sn-Ag-Cu eutectic lead-free solder for reflow soldering.

Peak Reflow Temperature: 230oC~235oC

SN97C PF-31N FMQ(Sn-Ag-Cu)

Stable viscosity in continuous printing.

Peak Reflow Temperature: 230oC~235oC

ePaste Lead-Free Solder Paste was added in Jan 2012

ePaste Lead-Free Solder Paste has been viewed 927 times

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