Via-in-Pad
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Via-in-Pad |
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Via-in-Pad Description:
10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA.
Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel width on the internal layers will not change. The process flow for this technology adds a great deal of time and labor to the standard MLB process flow, but achieves results and component footprints that are not possible in the standard process.
Via-in-Pad was added in Jan 2009
Via-in-Pad has been viewed 589 times
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