Edge Plating PCB / Castellations
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Edge Plating PCB / Castellations Description:
Edge Plating does not have a set definition per IPC. However, the industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges. Edge Plating can be used for a variety of purposes, including, but not limited to edge soldering, edge connections, and to increase current carrying capacity. Burrs Often edge plating, especially on castellations, can result in burrs from the final machining process.
We apply a modified, proprietary process flow that results in the burrs being polished down to the edge of the feature. Copper Peeling Plating over a large substrate surface can lead to the plated copper peeling due to a lack of adhesion strength. We address this by first roughening the surface through a combination of chemical and other proprietary means. We then use direct metallization, which has a higher copper bond strength, to prepare the surface for plating.
Edge Plating PCB / Castellations was added in Sep 2009
Edge Plating PCB / Castellations has been viewed 1879 times
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