GOEPEL Electronic
Vendor of systems for Automated Optical Inspection (AOI), 3D X-Ray Inspection (AXI)and 3D solder paste inspection (SPI). The company's inline and stand-alone AOI systems won several "Best in Test Awards"
The German company GOEPEL electronic GmbH (www.goepel.com) is a leading vendor of electric and optical test and inspection systems for electronic components, PCBs as well as vehicle control units.
The company was founded in 1991. In addition to the more than 200 people, who work in the company’s headquarters in Jena/Germany, GOEPEL electronic runs several support and services offices in Germany, France, the UK, China, India and the USA. More than 300 additional specialists ensure the local and on-site support of GOEPEL electronic’s products via the worldwide distribution network.
GOEPEL electronic has continuously been ISO9001 certified since 1996. The Company’s products won several awards in recent years and have been used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology and other industries.
GOEPEL electronic’s business units:
• JTAG/ Boundary Scan Equipment – Embedded System Access technologies
• Automated Optical Inspection Systems (AOI)
• Automated X-ray Inspection Systems (AXI)
• Automotive Test Solutions
• Functional Test Systems
• Digital Image Processing incl. Solder Paste Inspection Systems (SPI)
GOEPEL Electronic Postings
16 products »
The OptiCon THT-Line AOI system provides a parallel inspection of THT components and THT solder joints. In a typical THT production line, it is possible to inspect mounted components before the soldering processes as well as PCB solder jo...
Inline AOI System for flexible inline integration The OptiCon AdvancedLine AOI system’s benefits in numerous opportunities for inline integration into the production process. The system can be utilized at each position in a PCB...
Stand-alone AOI System for manual loading and flexible PCB adaptation The OptiCon BasicLine AOI system can also be utilized as a separate repair station and is characterized by a comfortable fault classification. Numerous...
How to stimulate and observe board- and system-level interconnects with Boundary Scan? How does the Test Access Port (TAP) work? How does the serial transmission of test pattern work? Th...
The SCANFLEX® Board Grabber is a universal tool to hold JTAG/Boundary Scan UUTs and modules. Oscilloscopes, logic analyzers or other instruments can be connected via additional nails probes. The Board Grabber can be used for rapid prototype...
JTAG/Boundary Scan as an innovative DfT method requires respective scanable components on the unit under test (UUT) for its application. Yet, this cannot always sufficiently be realized in practice, as, for example, edge connectors do not provide suc...
The Boundary Scan Probe serves as a handheld tool for debugging of UUTs and JTAG/Boundary Scan devices. It basically is a virtual JTAG/Boundary Scan pin providing several advantages, e.g. static and dynamic logic pen functionality. Probe the te...
In the recent years, PXI has established its position in the test and measurement industry, especially with such features as high data transfer rates, small rugged industrial footprint, open standard and multiple vendors. PXI (PCI eXtensions for Inst...
During the development of the CION™ technology, GOEPEL electronic focused on customer recommendations for a new generation of economical, yet flexible JTAG/Boundary Scan modules for installation into active test fixtures. Utilizing the unique CION™ t...
PicoTAP is the world's smallest JTAG/Boundary Scan Controller and perfect for learning Boundary Scan technology. The controller was developed to support designs of lower complexity. PicoTAP is characterised by: * small, compact and portable...
2 technical articles »
Void Detection in Large Solder Joints of Integrated Power Electronics
Dec 06, 2012 | Patrick Schuchardt
Inspection of integrated power electronics equals sophisticated test task. X-ray inspection based on 2D / 2.5D principles not utilizable. Full 3D inspection with adapted image capturing and reconstruction is necessary for test task.... First published in the 2012 IPC APEX EXPO technical conference proceedings. ...
THT in-line Inspection: Contradiction or greater Efficiency?
Jul 22, 2010 | Jens Kokott
The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic assemblies. Depending on batch size and product mixture, AOI systems as Inline integration or as a stand-alone solution benefit efficien...
8 news releases »
Goepel Presents Free Webinar on Quality Control of Plug-in Contacts Using 3D Measurement
Oct 13, 2015 | Goepel is pleased to announce their latest webinar, "3D Circumference Inspection for Connector Insertion - Quality Control of Plug-in Contacts using 3D Measurement Method" on Tuesday, October 27th.
eXception integrates GOEPEL electronic's Boundary Scan into Teradyne Test Station
Jul 20, 2011 | The British Contract Electronics Manufacturing Company eXception EMS has simplified and integrated Boundary Scan solutions into mainstream test strategy by incorporating equipment from GOEPEL electronic into a Teradyne test station.
GOEPEL electronic supports Picochip in testing next Generation 'Small cell' Baseband chips
Jul 13, 2011 | GOEPEL electronic has developed special VarioTAP® IPs for testing the new generation femtocell chips in cooperation with Picochip. The solution enables dynamic processor emulation tests (PET) for fault detection and diagnostic on board and system level, as well as supporting embedded Flash programming.
GOEPEL electronics runs 9th UK Technology Day in 2011
Mar 22, 2011 | GOEPEL electronics will run its 9th UK Technology Day. This event will take place on the 5th May 2011 in Duxford. The seminars will be covering latest developments, applications and outlooks in JTAG/Boundary Scan, Functional Test and optical inspection technologies.
GOEPEL electronic improves in-system Programming Capability of Flash Memories
Mar 10, 2011 | GOEPEL electronic announces the market introduction of another feature within the frame of the emulation technology VarioTAP®. The new option enables the utilisation of fast process-oriented communication interfaces such as LAN or USB2.0 for data transfer, in particular solving the throughput problem in programming massive Flash images.
GOEPEL electronic extends BSDL Testbench to Multi Chip Modules and 3D Chips
Mar 09, 2011 | GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions announces the availability of a new option in its recently introduced EDA software TAPChecker™. Multi-Chip Modules (MCM) and 3D chips are now supported, allowing testbench generation for VHDL, Verilog and STIL output formats.
Cooperation between GOEPEL electronic and DM&P enables new Test Strategies for x86 System-On-Chip
Mar 03, 2011 | GOEPEL electronic has developed special VarioTAP® IPs for testing VORTEX x86 chip series in cooperation with the Taiwanese Company DMP.
Fast Generation of production-oriented AOI Programs
Feb 26, 2011 | The newest version of GOEPEL electronic's AOI system software features a special highlight. An integrated debug statistics captures AOI relevant variations in the production process and provides them for statistical evaluations.
