Photo Stencil LLC
Photo Stencil provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries.
Photo Stencil, LLC provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries. Its innovations include the patented AMTX E-FAB® electroform stencils, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade® squeegee blade. Stencil design support and customer-specific design libraries are also provided. Founded in 1979, Photo Stencil is headquartered in Colorado Springs and has manufacturing facilities in Mexico and Malaysia. For more information follow us on www.linkedin.com/company/Photo-Stencil-LLC, visit www.photostencil.com, or email info@photostencil.com.
Photo Stencil LLC Postings
2 products »
Electroformed Stencils - Hard Nickel NiEX™
NiEX™ electroformed stencils use the same proprietary process as our market leading AMTX™ stencils. The NiEX™ stencil has a higher Knoop Hardness (HK) than our standard AMTX product for those very thin less than...
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own prop...
3 technical articles »
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Nov 05, 2015 | Rachel Miller Short, William E. Coleman Ph.D.; Photo Stencil | Joseph Perault; Parmi.
There has been recent activity and interest in Laser-Cut Electroform blank foils as an alternative to normal Electroform stencils. The present study will investigate and compare the print performance in terms of % paste transfer as well the dispersion in paste transfer volume for a variety of Electroform and Laser-Cut stencils with and without post processing treatments. Side wall quality will also be investigated in detail. A Jabil solder paste qualification test board will be used as the PCB test vehicle....
Electroformed vs. Laser-cut: A Stencil Performance Study
Jan 11, 2013 | By Michael R. Burgess and William E. Coleman, Ph.D., Photo Stencil
There have been claims in the industry that laser-cut electroformed nickel foil blanks provide stencil print performance comparable to electroformed stencils. A study was established to measure the quantitative differences in performance between the two during an independent lab study....
Stencil Printing of Small Apertures
Oct 25, 2012 | William E. Coleman Ph.D.
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated....
4 news releases »
Mar 10, 2016 | Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Photo Stencil Sells Guadalajara, Mexico Laser Stencil Business to Management Team
Dec 13, 2015 | Photo Stencil announces that it has sold the Photo Stencil business in Guadalajara, Mexico to the facility's management team, Francisco Lujano and Armando Berumen. Photo Stencil's Mexico facility produces laser-cut stencils and will continue to sell both the laser-cut stencils they manufacture and electroform stencils that will be made by Photo Stencil in its new Golden, CO facility.
Oct 11, 2015 | Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Sep 30, 2013 | Free Session, Spotlight 4, October 16, 2013
from 9:30-11:00 AM
