Viasystems Group, Inc.
A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs
Viasystems has the ability globally to support the customer’s full product life cycle from quick-turnaround PCBs for new product introduction to high-volume, low-cost fabrication of complex boards – combined with comprehensive sourcing, assembly, and metal fabrication capabilities to supply everything from subassemblies to finished electronic products.
Viasystems Group, Inc. Postings
2 technical articles »
Alternatives to HASL: Users Guide for Surface Finishes
Aug 09, 1999 | Dan T. Parquet and David W. Boggs, Merix
A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate....
Introducing the OSP Process as an Alternative to HASL
Aug 09, 1999 | David W. Boggs, Senior Process Engineer, Merix Corporation - Viasystem
Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements....
1 news release »
Viasystems Collaborates with Faraday Technology on Advanced Plating Technology
Oct 20, 2010 | Viasystems Group, Inc. and Faraday Technology, Inc. are collaborating on demonstration of the FARADAYIC(R) ElectroCell technology for the manufacture of printed circuit boards (PCBs) with high-density interconnect features and at high plating rates for improved productivity.
