VIA Series PCB Plasma Treatment Systems
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VIA Series PCB Plasma Treatment Systems |
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VIA Series PCB Plasma Treatment Systems Description:
Ideally suited for the printed circuit board (PCB) plasma manufacturing requirements, Nordson MARCH’s unique approach of isolated, temperature-controlled panel processing delivers superior plasma etching process capabilities for etch-back, plasma desmear and surface activation of large flexible or rigid panels of various sizes and roll-to-roll substrates.
Nordson MARCH’s large panel processing equipment can be configured with kHz or MHz RF Generation and is available in chamber sizes processing multiple panels from 12” x 18” up to 24” x 42”. Custom equipment configurations are available for large and thick panel requirements.
VIA Series PCB Plasma Treatment Systems:
MaxVIA Plasma Treatment System - specifically configured to meet the demands of today’s high throughput PCB manufacturing operations. Plasma treatment uniformity is a key operational feature in desmear and etchback applications for HDI, flexible and rigid circuit board manufacturing technologies.
ProVIA Plasma Treatment System - specifically configured to meet the demands of today’s high throughput PCB manufacturing operations. Plasma treatment uniformity is a key operational feature in desmear and etchback applications for HDI, flexible and rigid circuit board manufacturing technologies.
VIA Series PCB Plasma Treatment Systems was added in Feb 2014
VIA Series PCB Plasma Treatment Systems has been viewed 1312 times
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