Multi-Layer Flexible Circuits Fabrication Services

Multi-Layer Flexible Circuits Fabrication Services Description:

Multi-Layer flexible circuits consist of 3-6 copper layers encapsulated with dielectric, normally connected with a plated thru-hole (see diagram below). Multi-layer circuits can be fabricated with or without coverlayers.

When to Use Multi-Layer Flex:

• Required when circuit density and layout cannot be routed on a single layer
• Ground and power plane applications
• Used for shielding applications
• Dense surface mount assembly
• Increased circuit density
• EMI/RFI shielding
• Controlled impedance with shielding