SMT 256 Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant Description:

World's First Solder Joint Encapsulant

Perfect solution for customers looking to eliminate underfilling processes.

The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulation adhesive. The adhesive works like a flux gel but also surrounds the ball with a strong polymer adhesive film and bonds the ball to the component body and PCB without filling all of the space between the balls.

SMT 256 series dip adhesives were designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, flip chip and PoP, particularly for lead-free applications. SMT 256 can encapsulate the bumps on a component after dipping the component into the adhesive film. The implementation of SMT 256 can improve process yields, eliminating voids and crack in solder joint, removing head-in-pillow issues for large components during the lead-free reflow process.

• Customer Approved - Billions of Commercial Products use SMT256
• Enhance Solder Strength 5-10x
• High Cost Reduction
• Eliminates Underfill
• Improves Process Yield
• Higher Throughput
• Compatible with Production Lines
• 100% Reworkability