TM 150 Solderable Conductive Adhesive

TM 150 Solderable Conductive Adhesive Description:

TM 150 series solderable conductive adhesives is rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, and so on, to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. By comparison with conductive adhesives (Ag), TM 150 solderable adhesives has higher stable electrical and thermal conductivity, can easily-fill-gap and self-level die, and easily control of the bonding thickness. By comparison with soldering materials, TM 150 solderable adhesives eliminate the outgassing from soldering process, eliminate die skewing and shifting, soldering bleed. Soldered interface will be encapsulated with the curing of TM 150 solderable adhesives, thus soldered metal interface is protected by 3D polymer network, which can tolerate harsh environmental conditions.