SMT 266 Solder Joint Encapsulant

SMT 266 Solder Joint Encapsulant Description:

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). 

SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 266 is a kind of polymer solution and a polymer film will be formed after spraying onto the component footprint of print circuit board or substrate. During the reflow process, the polymer film removes metal oxide and allows solder joint to be formed, meanwhile, a 3-D polymer network starts to form and encapsulate individual solder joints with enhancing solder joint to eliminate some drawbacks of underfilling (large CTE above Tg, trouble process control). The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The polymer network can be removed using methyl ethyl ketone (MEK) or heating. 

• Enhance Solder Strength 5-10x
• High Cost Reduction
• Eliminates Underfill
• Improves Process Yield
• Higher Throughput
• Compatible with Production Lines
• 100% Reworkable