AlSi Bonding Pads
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AlSi Bonding Pads |
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AlSi Bonding Pads Description:
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained.
With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increase in performance while providing consistent quality and stability to the manufacturing steps needed to assemble the device
Applications for a Bonding pad
Printed Circuit Board (PCB)
Ceramic hybrid packages
Technical characteristics of Heraeus AlSi:Pad
Bondable with Al thick wire and AlSi thin wire
Bondable with Au gold bonding wire
Solderable for lead-free and leaded solder materials
Applicable on all soldered or glued surfaces
AlSi Bonding Pads was added in Aug 2012
AlSi Bonding Pads has been viewed 605 times