SMT Equipment

AlSi Bonding Pads

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AlSi Bonding Pads

AlSi Bonding Pads

Name:

AlSi Bonding Pads

Category:

Materials

Offered by:

Heraeus Materials Singapore Pte Ltd

   

AlSi Bonding Pads Description:

Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained.

With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increase in performance while providing consistent quality and stability to the manufacturing steps needed to assemble the device

Applications for a Bonding pad

Printed Circuit Board (PCB)
Ceramic hybrid packages

Technical characteristics of Heraeus AlSi:Pad

Bondable with Al thick wire and AlSi thin wire
Bondable with Au gold bonding wire
Solderable for lead-free and leaded solder materials
Applicable on all soldered or glued surfaces

AlSi Bonding Pads was added in Aug 2012

AlSi Bonding Pads has been viewed 605 times

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