Kapp Copper-Bond Flux - High Temperature Soldering Flux
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Kapp Copper-Bond Flux - High Temperature Soldering Flux Description:
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredients.
Excellent for use with KappTec™ - 95% Cadmium - 5% Silver, KappZapp7™ - 93% Tin - 7% Silver and most solders with temperature requirements above 550°F applied to metals other than Aluminum. Good wetting properties.
Effective soldering range - 550°F - 800°F (288°C - 427°C).
Residue is corrosive, easily removed with warm water rinse or a clean wet rag.
Call 800-327-6533 or email will@kappalloy.com for a quote.
Learn more: http://www.kappalloy.com/copper-bond-flux.php
Kapp Copper-Bond Flux - High Temperature Soldering Flux was added in Mar 2013
Kapp Copper-Bond Flux - High Temperature Soldering Flux has been viewed 642 times
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