Power PCB

Power PCB Description:

Layer：4
Material：FR-4 4/4/4/4oz
Thickness：2.0
Minimum hole：0.35mm
Minimum Tracc/Spacing：12mil/15mil
Application：power supply

Layers: 2--36layers
Max manufacturing size: 640mm*1100mm
Copper foil thickness:  0.5OZ-13OZ
Min line width/space:   3mil/3mil
Min finished holes size: 0.15mm
Aspect ratio: 12:1
Impedance control: +/-10%
Surface treatment: HASL；HASL with Pb free
Immersion Gold; Immersion Tin; Immersion Silver
Gold Finger; Flash Gold; OSP
Materials: FR4, Tg: 130℃/170℃,Rogers,Arlon,Taconic
Bergquist, Thermagon,
Special technique: blind&buried holes, via in pad,
Semi-plating holes, countersinked holes,
Step mounting holes, controlled depth holes
Edge-plating PCB and metal base PCB