Nextreme Thermal Solutions, Inc.

Nextreme designs and manufactures manufactures micro-scale electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets.

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Nextreme Thermal Solutions is Changing the Future of Thermal and Power Management

Nextreme designs and manufactures micro-scale thermal and power management products that overcome thermal and power constraints in electronics for applications in support of products for the telecom, consumer, test and measurement, industrial, automotive and government/aerospace markets.

The company has patented thin-film embedded cooling technology and power generation capabilities that have been incorporated into the widely accepted copper pillar bumping process used in high-volume electronic packaging.

Nextreme Thermal Solutions, Inc. Postings

1 technical article »

Embedded Thermoelectric Cooling

Mar 25, 2008 | Jesko von Windheim, Nextreme Thermal Solutions

Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly methodology used to implement these devices is fully compatible with existing surface mount approaches. In order to take advantage of these unique characteristics, thin film thermoelectric devices need to be designed for the appropriate thermal and form-factor environments, with system-level constraints carefully considered as an integral part of the overall design process....

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