Flip Chip Bonder Packaging System
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Flip Chip Bonder Packaging System |
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Flip Chip Bonder Packaging System Description:
Packaging System for Semiconductor and Electronic Device
Flip Chip Bonder is an equipment used in the semiconductor packaging process.
It is a method of connecting individual chips of wafers so that the bumps on the chip and electrodes of the substrate face each other, and unlike conventional wire bonding, the bump arrangement of chips and electrode arrangement of substrates are matched 1:1.
Compared to wire bonding, the field area and height are small, so it is advantageous for small and thin shapes and has excellent electrical characteristics due to minimizing signal length by 1:1 matching. Due to these advantages and technical requirements, it is used in markets such as TV, Mobile, CMOS, RF TAG, and MEMS as a technology that can respond to micro-pitch, 2.5D, and 3D packages.
FCB300+ Chip on Film
- High Speed & High Precision
- Over 17years of Experience & Know-how
- Vision Alignment & Image Process
- Motion & Force Control
- 12-inch Wafer Handling
FCB300CS for Chip to Substrate
- Various Application Flexibility
- High Precision
- Over 17years of Experience & Know-how
- Vision Alignment & Image Process
- Motion & Force Control
- 12-inch Wafer Handling
Flip Chip Bonder Packaging System was added in Aug 2020
Flip Chip Bonder Packaging System has been viewed 89 times
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