WASET - World Academy of Science, Engineering and Technology
A scholarly open access, peer-reviewed, interdisciplinary, monthly and fully refereed journal focusing on theories, methods and applications in Science, Engineering and Technology.
Media / Publisher / Online Resource
World Academy of Science, Engineering and Technology, is open access journal of full text paper of peer-reviewed scientific research, and enables fast dissemination of high quality scientific and technical information freely available worldwide.
World Academy of Science, Engineering and Technology aims to maintain a rapid editorial procedure and a rigorous peer-review system. The submitted articles are reviewed within approximately three months of submission and the accepted full text articles are published on the internet immediately upon receiving the final versions at no cost.
WASET - World Academy of Science, Engineering and Technology Postings
1 technical article »
Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow
Jun 12, 2014 | Arijit Roy
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis....
