Plasma Cleaner
Company Information:
Name: |
Plasma Cleaner |
Category: |
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Offered by: |
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Plasma Cleaner Description:
Plasma Cleaner
Low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.
Application:
- LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic components, electronic components, Packaging before the clean.
- Before printing or adhesive surface roughening or cleaning.
Feature:
- Desktop design, small footprint, does not take up much space
- Equipment for schools, laboratories, medical institutes, R&D units and electronic factories
- R&D costs and low equipment costs
- Equipment operation is easy, actions are simple and easy to understand
- Bombardments of electrodes
- High density plasma source
- Processing speed, clean, high efficiency, high reliability
- Low ion energy can be controlled, does not damage the substrate
- Combination of chemical reactivity and physical bombardments
- Extremely high plasma uniformity
- Equipment can remove oxides and sulfides
- The best surface cleaning and treatment effects
- High reliability and easy maintenance
- Customization
Specification:
Footprint |
1270(W)*1100(D)*2216(H)mm |
Chamber Size |
500(W)*500(D)*500(H)mm |
Weight |
880kg |
Facilities |
3Ø 220V*60Hz*4w,30A Compressed air:about 6 kg/ cm² Reaction gas:about 3 kg/ cm² |
System control software |
PLC touch panel |
Gas flow system |
2 mass flow controllers |
Vacuum pump |
Mechanical(80m3/hr)+Roots(250m3/hr) |
Reactants |
O2, Ar, H2, N2 & mixing gases |
Used before wire bonding |
OK |
Used before molding |
OK |
Consumable parts |
NO |
Plasma Cleaner was added in Aug 2018
Plasma Cleaner has been viewed 324 times
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