SMT Equipment

BGA Chip Desoldering and Soldering Machine

Company Information:

Plastlist is a professional industrial solution provider, who is in engaged in design, manufacturing, equipment agency, material & accessories supply.

Taichung, Taiwan

Consultant / Service Provider, Manufacturer

  • Phone 886-423-260-632

See Supplier Website »

Company Postings:

(23) SMT parts, accessories & PCB supplies items

(161) products in the catalog

BGA Chip Desoldering and Soldering Machine

BGA Chip Desoldering and Soldering Machine

Name:

BGA Chip Desoldering and Soldering Machine

Category:

Rework & Repair Equipment

Offered by:

Plastlist Group

BGA Chip Desoldering and Soldering Machine Description:

BGA Chip Desoldering and Soldering Machine

Features:

3 independent control heaters:

-Integrated design of top heater with efficient ceramic heater; Air source, including compressed air and nitrogen, is changed freely to meet repairing requests.

-It is convenient to use bottom heater and top heater in the meantime by the system of synchronized operation and electric lift.

-Large size IR heater, high performance heat pipes and the micro crystal plate so that preheat PCB thoroughly.

Precise optical alignment system

-Adopt adjustable CCD colour optical system, with a beam split, zoom in, zoom out and micro adjust functions

-automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image, with 15” HD monitor. -Can repair the lead-free socket 775, double deck BGA chipset, and lead-free repairing.

Multi-function operation system

Superior safety functions

With CE certification, emergency button and abnormal incident power off automatically protect device, with protective screening, to protect the operator and the spare parts from damage. 

Specification:

Total Power (W)

Max 5800

Heater power (W)

Top heater 800

bottom 800

IR 4000

Power

AC 380V 50/60Hz                   

Electrical materials

Servo Drive (Panasonic)

10”Touch screen

Panasonic PLC

Precision Thermal control system   

Temperature control

K-type thermocouple (Closed Loop)

Positioning

V-groove, PCB support + laser automatic positioning

PCB size (mm)

Min 15×20

Max 560×470

BGA chip (mm)

Min 2×2

Max 80×80  

Dimensions (L×W×H) (mm)

760×850×950 (LCD stand not included)

Sensors

4pcs

Weight (kg)

149

BGA Chip Desoldering and Soldering Machine was added in Aug 2018

BGA Chip Desoldering and Soldering Machine has been viewed 402 times

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