Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Description:

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs:

http://eurekadrytech.com/fast-super-dryer/sdc-2001

Model: Eureka SDC-2001 Fast Super Dryer
Capacity: 1314 Liters
Humidity Range: LESS THAN 10%
Recovery Time: Recovers to ≤ 10% RH within 30 minutes after accessing door for 30 seconds or less.
External Dimension: 120*193.5*76 cm (W*H*D)
Internal Dimension: 110*174*61 cm (W*H*D)
Door Type: Anti-Static Glass
Hygrometer: German Digital TESTO Thermal Hygrometer
Power Consumption: 150 Watts
Lock Type:Standard

Anti-static Glass,
Anti-static Paint on Body and Shelves,
​Anti-static Caster / Stands,
1 M ω Ground Wire

As development cycles shorten, invention of ever-smaller device, innovative usage of new materials and larger wafer chips development, are all contributing to a rapid increase of moisture-sensitive devices and higher levels of moisture/reflow sensitivity. Due to moisture expansion, internal component damage will result in MSDs during surface mount reflow process. Storing MSD's in Eureka's Super Dryer will provide you with extended floor life and will prevent moisture expansion, popcorning, and other moisture related problem from occurring in the first place.

How does moisture affect SMT production?

• Trace moisture causes failures to components and PCBs during high temperature reflow process. When absorbed moisture rapidly expand from high temperatures, common internal component damages and failures such as micro-cracking, blistering, popcorn effects will occur in moisture sensitive devices, packages and components.
• Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB when moisture inside the layers causes expansion during the reflow process.

Moisture problems solved with Eureka’s Ultra-low Humidity Storage Dry Cabinet

Eureka’s dry cabinets, dry boxes, and desiccators will provide ultra-low humidity storage environment conforming to IPC/JEDEC J-STD 033 & IPC-1601, storage and handling standards for MSDs and PCBs. Eureka Fast Super Dryer also dehumidifies during storage, providing alternative drying methods optimal for removing moisture in all moisture sensitive materials in SMT production, solving all moisture damage problems during reflow process.

• Baking process uses high temperature to dry PCBs and will cause breakdowns of protective coatings, lead oxidation, intermetallic buildup and reduces solder ability of circuit boards.
• Nitrogen and dry air purge is costly and will only force moisture from the storage cabinet providing a humidity controlled environment. Nitrogen purging will not dry or remove moisture that has absorbed into the moisture sensitive materials, components or devices.

Features of Eureka Fast Super Dryer’s Ultra-low Humidity Dry Storage:

• Stable and reliable humidity control storage @ <10% RH (SDC series)
• Fast recovery times in ambient temperature and pressure (NTP) conditions without using costly nitrogen (N2) or dry air purging. Solving all moisture related problems while increasing yield rates.
• Moisture is removed and expelled from the cabinets by the use of desiccant dehumidifiers which automatically regenerates. No fans are required to ventilate.
• Dual hydrometer sensor designs with independent hydrometer monitoring relative humidity levels inside the cabinet.
• Provides moisture sensitive devices indefinite floor-life meeting IPC/JEDEC J-STD 033 standards. 
• Eureka’s dry cabinets will provide storage environment meeting IPC 1601 standards optimal for multi-layer Printed Circuit Board / Printed Wire Boards.
• All of Eureka’s Fast Super Dryer dry cabinets are equipped with anti-static paint, glass, casters and 1M ohm grounding cable meeting IEC-61340-5-1 (ESD) Standard.