3M Wafer Support System

3M Wafer Support System Description:

The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent between the glass support substrate and the wafer.  The mounting process is performed under vacuum ensuring that no bubbles are entrapped between the wafer and the support glass. Grinding stress to the wafer can be minimized because the UV-curable adhesive flows into and supports the topography of the circuit patterns on the front side of the wafer. This uniform support allows wafer thinning to less than 20µm final thickness.  After wafer thinning, the glass substrate provides support for any post grind processes such as etch, CMP, metal deposition or simple transfer to dicing tape and frame where the glass substrate is removed by laser debonding of the adhesive-glass interface. And thinning the wafer is only one step in our process offerings.  Syagrus Systems can take your thin wafer all the way to singulated die form by allowing us to provide you with our professional wafer dicing services, automated die visual inspection services and wafer die sort services.

LTHC Coating Services

Syagrus Systems also provides glass substrate coating services. The Light To Heat Conversion (LTHC) layer is applied via spin coating process and cured for use with the 3M WSS process.  Glass substrates are verified after coating for proper levels of light transmittal