FPC to PCB Board Pulse-Heated Soldering Machine

FPC to PCB Board Pulse-Heated Soldering Machine Description:

Specifications:

FPC Soldering Machine YSPP-1A
1. Accurate Tin press,not drag.
2. Accurate heat.
3. Fine-pitch position.
4. Digital program pressure control.

Features:

FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine
1.Extremely short cycle time with rotary table design. Product loading and

unloading can be done during the heat sealing process.
2.High quality heat seal application up to 0.25mm pitch.
3.Pneumatic bonding head provide up to 3,900N force.
4.Digital programmable pressure control with LCD display.
5.Closed loop PID temperature control with visible LED display.
6.Bonding cycle is triggered by a real time pressure sensor.
7.Floating Thermode ensure consistent pressure and heat transfer along

the flexfoil to LCD and/or PCB.
8.Precision product fixtures (2X), easy exchange, provided with micrometer

alignment and vacuum to fix components.
9.Optional CCD alignment module with frame, camera, lens, monitor and

illumination for fine pitch application.
10.Full microprocessor logic control.