VERMES Microdispensing Hot Melt Dispensing System

VERMES Microdispensing Hot Melt Dispensing System Description:

The system is an optimal solution for hot glue applications. Hot melt, a thermoplastic adhesive perfectly changes its solid state to liquid when passing through the zones of increasing temperature; an ideal application for the electronic industry, e.g. for bonding electronic gadgets, smart phone components, 3D MID (Molded Interconnect Device) and PCBs (Printed Circuit Boards). It is also perfect for Dam and Fill dispensing techniques especially in VHD (Very High Dam) applications. VERMES Microdispensing has developed the powerful cartridge heater that can be connected with the widely known dispensing valves, such as MDV 3200A-HS and MDV 3200A-AC for high speed applications. In combination with this cartridge heater and nozzle heater VERMES Microdispensing can handle hot melts with a processing temperature up to 180 °C (and even more) and dispense lines and dots down to 200 µm diameters. Thanks to the variously programmable controller it is also possible to dispense complex patterns by the special software option "scenario". Freely adjustable parameter settings allow customizing the jet properties to almost all requirements and fluid properties.