SMT Equipment

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board

Company Information:

IC substrate Manufacturer akenzhang@horexspcb.com BGA/FCCSP/Bumping/Sip/CSP/Memory/Module substrate

huizhou city,

Manufacturer

  • Phone 13825288578
  • Fax 13825288578

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(28) products in the catalog

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board

Name:

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board

Category:

Fabrication Services

Offered by:

Horexs (Hubei)Electronic Limited/HongRuiXing

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board Description:

Horexs (Boluo HongRuiXing Electronic Limited)is thin FR4 PCB factory(0.1-0.4mm FR4 pcb/2L&multilayer), factory is located in huizhou city China,nearby Shenzhen city. Factory area of Horexs is more than 10000 square meters, which invested 30 million USD, has more than 200 employees, more than 30% technical engineers,And machines was imported from Japan, the monthly production capacity is more than 20000 square meters, whole process of thin FR4 PCB factory. 

Horexs's PCB mainly use for the products are: USB,IC Substrate,digital cemera card,TF card,MEMS,5G electronics, Memory Card,SD card,Mini LED,UDP, SIM card, CMOS, fingerprint identification card, antenna board,Bank card,IC card, etc.

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board was added in Oct 2020

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