SMT Equipment

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold

Company Information:

IC substrate Manufacturer akenzhang@horexspcb.com BGA/FCCSP/Bumping/Sip/CSP/Memory/Module substrate

huizhou city,

Manufacturer

  • Phone 13825288578
  • Fax 13825288578

See Supplier Website »

Company Postings:

(28) products in the catalog

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold

Name:

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold

Offered by:

Horexs (Hubei)Electronic Limited/HongRuiXing

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold Description:

Horexs (Boluo HongRuiXing Electronic Limited)is thin FR4 PCB factory(0.1-0.4mm FR4 pcb/2L&multilayer), factory is located in huizhou city China,nearby Shenzhen city. Factory area of Horexs is more than 10000 square meters, which invested 30 million USD, has more than 200 employees, more than 30% technical engineers,And machines was imported from Japan, the monthly production capacity is more than 20000 square meters, whole process of thin FR4 PCB factory. 

Horexs's PCB mainly use for the products are: USB,IC Substrate,digital cemera card,TF card,MEMS,5G electronics, Memory Card,SD card,Mini LED,UDP, SIM card, CMOS, fingerprint identification card, antenna board,Bank card,IC card, etc.

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold was added in Oct 2020

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold has been viewed 49 times

20 More Products from Horexs (Hubei)Electronic Limited/HongRuiXing :

best reflow oven

IPC Certification Training Schedule