SMT Vacuum Reflow Oven

SMT Vacuum Reflow Oven Description:

Inclusions/voids will be reduced up to 99% Vacuum process can be switched on or off Nitrogen and
air soldering possible Double sided PCB possible
Pass through height: 30 mm (top and bottom) Small PCB with carrier
Setting parameter: Time until sub-pressure, holding time sub-pressure, venting time, sub-pressure
Only one sealing surface of the vacuum chamber Small footprint
No increase in nitrogen consumption

http://www.douyee.com/en/products/96/smt-equipment

if you are interesitng it, you can contact me with the following information

E-mail: Dennis.jiang@douyee.com.hk

H/P:+86-13828709515