ITW EAE
ITW EAE is a manufacturer of equipment used in the electronic assembly and semiconductor industries. The group brings together world-class products from Camalot, Despatch, Electrovert, MPM, and Vitronics Soltec.
innovations on the ZEVAm+ Selective Soldering Machine - Interview at APEX 2020
ITW EAE is a division of the Illinois Tools Works, Inc. (NYSE: ITW), a Fortune 200 global industrial manufacturer with operations in 58 countries. ITW EAE is a developer and provider of capital equipment used in electronics manufacturing, and is found in premier printed circuit board (PCB) assembly facilities the world over.
ITW EAE comprised with industry-leading brands: MPM printing equipment for electronic materials; Camalot Systems fluid dispensers; Electrovert reflow soldering, wave soldering, and curing, and cleaning equipment; Vitronic Soltec selective soldering, reflow soldering and wave soldering equipment; and Despatch industrial oven and furnaces.
ITW EAE manufacturing centers are located in Camdenton, Missouri, USA; and in Suzhou, China. Sales and support offices are located in Franklin, Massachusetts, USA; Lakeville, MN, USA; Camdenton, Missouri, USA; Guadalajara, Mexico; Singapore, Suzhou, China; Oosterhout, Netherlands; and in Frankfurt, Germany.
ITW EAE Postings
23 products »
MPM® Edison Next Generation Scalable SMT Printer
Unparalleled throughput and accuracy in an advanced next generation scalable printer platform. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Devi...
MPM Momentum II HiE High Efficiency Stencil Printer
Repeatable Printing Quality for High Yields The new Momentum II HiE is a single-rail stencil printer with servo motors, rather than stepper motors, driving the vision system’s X, Y, and Z axes. Faste...
MPM Momentum II 100 Stencil Printer
A value-priced high-performance printing solution designed to meet the demands of high-volume production The Momentum® II 100 stencil printer is a hard-working, val...
MPM Momentum II Elite High Throughput Stencil Printer
Effective and efficient solution for the most challenging printing applications. The MPM Momentum II stencil printer is a proven, highly productive printer platform with a new set of enhanced technologies for f...
MPM Momentum II BTB - Back to Back Stencil Printer
The MPM® Momentum® II BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentu...
Camalot® Prodigy™ Fluid Dispenser
Innovation, performance and flexibility driven specifically toward the needs of the Automotive, Smartphone and Semiconductor markets. The Camalot® Prodigy™ dispensing system employs breakthrough techno...
Camalot® Prodigy DL™ Dual Lane Dispenser
Smarter, Faster and Highly Versatile The Camalot® dispenser is designed and built to deliver extremely accurate dispensing at high speeds, exceptional frame stability and state of the art drive systems enable 1....
ELECTROVERT Aquastorm 50 Batch PCB Cleaner
In-line technologies in a batch footprint. Today’s challenges for PCB manufacturers hinge on high density, increasing complexity, and miniaturization. Manufacturers who currently clean with batch-typ...
ELECTROVERT Aquastorm 60 In-line PCB Cleaner
Matching Fooprint to Application The Aquastorm 60 in-line cleaning system is ideal for PCB, semiconductor, and industrial cleaning type applications in which the manufacturing volume has outgrown the capability of a bat...
ELECTROVERT Aquastorm 100 In-line PCB Cleaner
The Electrovert Aquastorm is a versatile, high performance cleaning system designed to optimize the PCB cleaning process while minimizing overall cost. The Aquastorm features the most advanced cleaning technologies in an energy-eff...
5 technical articles »
Understanding the Cleaning Process for Automatic Stencil Printers
Nov 10, 2021 | Ed Nauss
The automatic stencil wiper - first line of defense * The Printing process and why we need to focus on the wiping function * Frequency of wiping * Wiping options * Wiper profiles • Event driven wiping * Advanced options * Materials – Paper * Materials – Solvent * Preventive maintenance * Random stuff...
Understanding the Cleaning Process for Automatic Stencil Printers
Jun 28, 2021 | Ed Nauss
The automatic stencil wiper –first line of defense 2 • The Printing process and why we need to focus on the wiping function • Frequency of wiping • Wiping options • Wiper profiles • Event driven wiping • Advanced options • Materials – Paper • Materials – Solvent • Preventive maintenance • Random stuff...
Reliable Selective Soldering For High Volume Assemblies
Apr 14, 2020 | Gerjan Diepstraten
The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products....
Stencil Printing 008004/0201 Aperture Components
Apr 14, 2020 | Edward C. Nauss, Michael Butler
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined....
Selective Solder Fine Pitch Components On High Thermal Mass Assembly
Apr 14, 2020 | Gerjan Diepstraten
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly....
21 news releases »
ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave
Aug 28, 2020 | ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.
Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering
Apr 14, 2020 | ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.
MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers
Apr 14, 2020 | ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.
MPM Completes Next Generation Momentum II Printer Line with Introduction of BTB and 100 Models
Apr 14, 2020 | ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.
Electrovert 'DwellFlex 4.0' Wave Solder Nozzle Wins New Product Innovation Award at IPC APEX 2020
Apr 14, 2020 | EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.
Apr 14, 2020 | ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.
Apr 14, 2020 | The U.S. Patent and Trademark Office has issued Patent No. 10,434,537 protecting Dynamic Dual Head™ (DDH) dispensing technology for the Camalot® Prodigy™ Dispenser. The Prodigy Dispenser employs breakthrough technology that delivers high-speed, extremely accurate materials dispensing for electronics assembly and packaging with tighter tolerances, and higher yields.
Apr 14, 2020 | ITW EAE has earned a coveted Global Technology Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented to Camalot Prodigy Business Manager, Hugh Reed and Engineering Manager Scott Reid during a ceremony at Productronica in Munich Germany.
MPM Introduces Next Generation Momentum II Printer
Nov 05, 2019 | ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.
MPM to Present Technical Paper on Stencil Printing 0201 metric Apertures at Productronica
Oct 15, 2019 | A new technical paper that focuses on the application requirements of printing small apertures and the results of a design of experiment testing will be presented at the upcoming Productronica trade fair in Germany. The paper will be presented by Edward Nauss, MPM Applications Engineer at ITW EAE.
