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ceramic metalization

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ceramic metalization

ceramic metalization

Name:

ceramic metalization

Category:

IC Packaging

Offered by:

Folysky Technology(Wuhan)Co.,Ltd

ceramic metalization Description:

陶瓷材料表面/表面镀层/表面处理:陶瓷材料金属层:定制导电层:铜金属层的厚度:定制表面:浸金/重/osp 单/双面:单/双面

1..精高,电热性能好,补充强度高。2。焊接性好,可实现盲孔通孔。3。技术成熟,环保,无污染,成本训练传统技术。4。应用范围广,可5。定制生产,无需开模,生产周期短。

ceramic metalization was added in Mar 2021

ceramic metalization has been viewed 98 times

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