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high conductivity ceramic aluminum copper clad pcb

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high conductivity ceramic aluminum copper clad pcb

high conductivity ceramic aluminum copper clad pcb

Name:

high conductivity ceramic aluminum copper clad pcb

Category:

IC Packaging

Offered by:

Folysky Technology(Wuhan)Co.,Ltd

high conductivity ceramic aluminum copper clad pcb Description:

合金镀层:陶瓷制造工艺材料厚度:0.635mm导电层:Cu,Ni,Au金属层厚度:300um 表面处理:浸金单面/双面金属:单镀铜通孔:否焊焊层:否

1..精高,电热性能好,补充强度高。2。焊接性好,可实现盲孔通孔。3。技术成熟,环保,无污染,成本训练传统技术。4。应用范围广,可5。定制生产,无需开模,生产周期短。

high conductivity ceramic aluminum copper clad pcb was added in Mar 2021

high conductivity ceramic aluminum copper clad pcb has been viewed 96 times

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