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high heat disipation performance ceramic pcb

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high heat disipation performance ceramic pcb

high heat disipation performance ceramic pcb

Name:

high heat disipation performance ceramic pcb

Category:

IC Packaging

Offered by:

Folysky Technology(Wuhan)Co.,Ltd

high heat disipation performance ceramic pcb Description:

基板类型:氮化铝陶瓷基板材料厚度:0.65mm导电层:Cu金属层厚度:75mm / 75mm表面处理:浸金单面/双面:双面镀铜通孔:是阻焊层:否

1。.精度高,电热性能好,插入强度高。2。焊接性好,可实现盲孔通孔。3。技术成熟,环保,无污染,成本低于传统技术。4。应用范围广,可5。定制生产,无需开模,生产周期短。

high heat disipation performance ceramic pcb was added in Mar 2021

high heat disipation performance ceramic pcb has been viewed 111 times

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