The Technique of Sliton Three-Dimensional Ceramic Substrate of LAM Laser Boring
Company Information:
Name: |
The Technique of Sliton Three-Dimensional Ceramic Substrate of LAM Laser Boring |
Category: |
|
Offered by: |
|
The Technique of Sliton Three-Dimensional Ceramic Substrate of LAM Laser Boring Description:
在我们的专业团队的帮助下，我们的最小光圈值可以达到0.06 mm，线宽和距离的偏移可以达到0.1 mm以下，而行业的光圈可能为0.15-0.5mm。3D陶瓷板，因为传统工业通常采用图形电镀或直接蚀刻来制作电路，这些但是，我们的LAM技术可以选择镀铜并直接制作电路，
基材类型：氧化铝陶瓷
基板材料厚度：0.65mm
导电层：铜
金属层厚度：200μm
表面处理：OSP
金属单面/双面：双面
镀铜通孔：是的
焊锡面膜：是的
The Technique of Sliton Three-Dimensional Ceramic Substrate of LAM Laser Boring was added in Mar 2018
The Technique of Sliton Three-Dimensional Ceramic Substrate of LAM Laser Boring has been viewed 354 times
20 More Products from Folysky Technology(Wuhan)Co.,Ltd :
