Seamark Cheap price micro focus industrial X-ray inspect system X-5600 for electronics mobile phone PCBA BGA non welding inspection

Seamark Cheap price micro focus industrial X-ray inspect system X-5600 for electronics mobile phone PCBA BGA non welding inspection Description:

Micor focus X-ray inspection , X-ray chip counter, Bga rework station, contact Rita Li by:

Skype:ritaleeli

whatsapp:0086 134 3448 1030

Email:sales11@zhuomao.com.cn

Product Application:

X-Ray inspection is a method of non-destructive testing where many types of manufactured components can be examined to verify the internal structure  via the penetration power from X-Ray.

Seamark Zhuomao X-5600 X-ray inspection machine  has been widely applied to 

PCBA, LED, SMT, semiconductor, battery, casting, plastic,connectors,cable etc

Specific application:

1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6) Inner rupture or hollow inspection in plastic or metal.
7) Battery stacking uniformity, electrode welding inspection.

Contact Rita Li for customised machine and function for your products and requirements!

Main Features

Stage Control Parts 
1.By the space bar to adjust stage speed: Slow, Constant and Fast
2.Keyboard control X, Y, Z axis motion and the inclined angle 
3.User can detect the samples automatically by programmed
4.Large navigation window, the image is very clear, mouse clicks will move the stage to a position that you need.
CNC programming 
1. A simple mouse clicks will create a Testing procedures
2. The stage can be X, Y axis positioning; X-ray tube and the detector will be positioning in Z axis
3. Software setting voltage and current
4. Image setting: Brightness, contrast, automatic gain and exposure
5. User can set the program switch pause time
6. The anti-collision system can meet the maximum tilt and observe objects
7. Automatic analysis BGA diameter, Void ratio, size and roundness

Full Automatic Testing Procedures
Click programming without the need for operator intervention on the component can detect automatically.

Technical Parameters