Cleaning machine for electronic assembly Hydro-clean LDS

Cleaning machine for electronic assembly Hydro-clean LDS Description:

Cleaning application
Removing all kinds of solder residues
Cleaning of micromechanical components
Cleaning contamination from handling and board manufacturing, removing FOD
Cleaning highly populated electronic assemblies with low standoff such as BGA, CSP, BTC, QFN, MELF
Cleaning of power electronics
Electronic assemblies requiring extra short process time
Second side misprints on complex assemblies
Cleaning before conformal coating and wire bonding

Unique advantage
Fully automatic spray-in-air closed loop zero drain system
Triple capacity configuration
Linear direct spray for equal washing of entire surface
100% filtration of entire DI water
Optional triple rinse
Hot air knife direct dry technology
Window for visual process control
All process steps with up to 5 substeps for highest flexibility
Wide range of standard and customized PCBA fixtures

Clamping for all types of stencils
Up to 3 fully separated liquid loops
Versions by application
Wash + Rinse I + Rinse II + Drying  PCBA after soldering, PCBA before coating，power electronics,  micromechanics
Filtration options
Zero drain concept-close loop, cascade or open loop can be set by software only
Special filtration strategy for the highest low
First rinse filtration fully separated from second rinse filtration
Low consumption of chemicals and water
Proportional level sensors in all processes
Outstanding options of water utilization