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Technical Articles From Heller Industries Inc.

Read technical articles about electronics manufacturing added by Heller Industries Inc.

2 technical articles added by Heller Industries Inc.

Company Information:

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA


  • Phone 973-377-6800
  • Fax 973-377-3862

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Company Postings:

(9) used SMT equipment marketplace items

(9) products in the catalog

(2) technical library articles

(21) news releases

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Jan 28, 2020 | Heller Industries

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers....

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Jul 10, 2019 | M. Barnes, D.W. Lee, D. Heller - Heller Industries, M.Holtzer, T. Cucu - Alpha Assembly Solutions, J. Fudala, J. Renda - MacDermid Enthone Electronic Solutions

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation....

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