Fragility of Pb-free Solder Joints

Published:

April 18, 2007

Author:

Universal Instruments Corporation

Abstract:

Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service....

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Company Information:

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

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