A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing
Published: |
December 13, 2007 |
Author: |
Steve Watkin, Semicon Packaging Technologies Division, and Tom Falcon, Future Technologies Group, DEK |
Abstract: |
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.... |
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