Process Development And Characterization Of The Stencil Printing Process For Small Apertures
Published: |
January 16, 2008 |
Author: |
Dr. Daryl Santos, SUNY Binghamton; Dr. Rita Mohanty, Speedline Technologies |
Abstract: |
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.... |
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