SnAgCuBi and SnAgCuBiSb Solder Joint Properties Investigations
Published: |
February 5, 2008 |
Author: |
Kisiel R., Institute of Microelectronics and Optoelectronics; Bukat K. and Sitek J., Tele and Radio Research Institute; Gasior W., Moser Z. and Pstru_ J., Polish Academy of Sciences |
Abstract: |
This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders. The influence of added elements on the electrical and mechanical properties of solder joints created by these solders between PCB and electronic components were evaluated.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences »
- Apr 15, 2008 - Laser Direct Imaging of Tracks on PCB Covered With Laser Photoresist
- See all SMT / PCB technical articles from Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
SnAgCuBi and SnAgCuBiSb Solder Joint Properties Investigations article has been viewed 564 times
