Pushing the barriers of wafer level device integration: High-speed assembly, the case for MicroTape.
Published: |
January 21, 2009 |
Author: |
Gordon Christison |
Abstract: |
Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology.... |
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