A HDMI Design Guide For Successful High-Speed PCB Design
Published: |
March 25, 2009 |
Author: |
Thomas Kugelstadt, Senior Systems Engineer; Texas Instruments Inc. |
Abstract: |
This article presents design guidelines for helping users of HDMI mux-repeaters to maximize the device's full performance through careful printed circuit board (PCB) design. We'll explain important concepts of some main aspects of high-speed PCB design with recommendations. This discussion will cover layer stack, differential traces, controlled impedance transmission lines, discontinuities, routing guidelines, reference planes, vias and decoupling capacitors.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Texas Instruments »
- Dec 03, 2009 - BGA Package Component Reliability After Long-Term Storage
- Dec 03, 2009 - Component Reliability After Long Term Storage
- May 07, 2008 - Printed Circuit Board Tracking with RFID: Speed, Efficiency and Productivity Made Simple.
- See all SMT / PCB technical articles from Texas Instruments »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
A HDMI Design Guide For Successful High-Speed PCB Design article has been viewed 716 times
