Fluid Flow Mechanics Key To Low Standoff Cleaning

Published:

September 18, 2009

Author:

Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D.; ZESTRON, Steve Stach, Austin American Technology Corp.

Abstract:

In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil....

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Company Information:

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas,

Consultant / Service Provider, Manufacturer, Training Provider

  • Phone (703) 393-9880
  • Fax (703) 393-8618

See ZESTRON Website »

Company Postings:

(17) products in the catalog

(10) technical library articles

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