Aiming for High First-pass Yields in a Lead-free Environment
Published: |
March 4, 2010 |
Author: |
Mario Scalzo Senior Technical Support Engineer CSMTPE, Six Sigma Black Belt, Indium |
Abstract: |
While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects... |
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