Ceramic to Plastic Packaging
Published: |
April 15, 2010 |
Author: |
Michael D. Frederickson, EMPF Director; Barry Thaler, Ph.D. EMPF Technical Director Empfasis Technical Editor; Paul Bratt, Empfasis Editor. |
Abstract: |
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.... |
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