Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints
Published: |
April 29, 2010 |
Author: |
Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno |
Abstract: |
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.... |
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